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Technology Details
| Lead-Free Solder |
| Reference: |
1732 |
| Summary: |
Researchers at Iowa State University have developed a lead-free solder for use in electronic soldering including electronics circuit boards used in cell phones, computers and other electronics.
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| Description: |
This eutectic solder consisting of tin, silver and copper, known as SAC alloys, are ternary eutectic compositions having a eutectic melting temperature of about 217 ºC. These alloys provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15ºC above the eutectic melting temperature).
These low melting point alloys have been in use since 1994. As a result of the movement to reduce environmental contamination resulting from disposal of lead containing electronics components, government regulations in many countries prohibit use of leaded solders for electronics. SAC alloys and are now a standard in the electronics industry. Non-exclusive licenses are available and over 50 companies world-wide have licenses to U.S. Patent Number 5,528,621 C1. (Certificate of Correction)
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| Group: |
This technology is related to ISURF #2234. |
| Advantage: |
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An industry standard for lead free soldering
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Easy to use
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Low melting temperature
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Stand up well to corrosion and oxidation
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Excellent high temperature performance
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| Application: |
Electronics manufacturing |
| References: |
1: “Implementing Pb-Free Soldering”, Iver E. Anderson, Kenneth Kirkland, and Wayne Willenberg, November, 2000, SMT pp. 78-81. |
| Supporting Documents: |
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| Patents: |
5527628 C1 (Issued March 10, 2009) Entitled "Pb-Free Sn-Ag-Cu Ternary Eutectic Solder"
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| License Associate: |
Mary Kleis
E-mail: licensing@iastate.edu
Phone: 515-294-3893
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| Keywords: |
Lead free solder, electronics, tin, silver, copper, Ames Laboratory |
| Entry Date: |
August 26, 2010 |
| Revised Date: |
November 5, 2010 |
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